DEVELOPMENT OF CYCLIC SLIP BANDS IN UFG COPPER IN GIGACYCLE FATIGUE
DOI:
https://doi.org/10.12776/ams.v19i2.92Keywords:
ultrafine-grained copper, gigacycle fatigue, cyclic slip bandsAbstract
Ultrafine-grained (UFG) copper studied in this paper was produced by equal channel angular
pressing (ECAP) method and tested in gigacycle fatigue region. In contrary to conventional
grain size copper, the appearance of cyclic slip bands is quite rare and surface relief does not
form well below the fatigue limit. The cyclic slip bands develop in regions of near-by oriented
grains, where the neighbouring grains have very simmilar disorientation. Length of the cyclic
slip bands substantially exceeds the average grain size of UFG Cu. No grain coarsening due to
cycling was observed. Development of damage, which finally results in fatigue crack initiation,
was observed below the surface relief.
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Published
2013-06-30
How to Cite
Navrátilová, L. . (2013). DEVELOPMENT OF CYCLIC SLIP BANDS IN UFG COPPER IN GIGACYCLE FATIGUE. Acta Metallurgica Slovaca, 19(2), 88–93. https://doi.org/10.12776/ams.v19i2.92
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Research papers