DUONG, N. B. INTERMETALLIC COMPOUNDS FORMATION OF SOLDER ALLOYS ON Ni/Au SURFACE FINISH COPPER. Acta Metallurgica Slovaca, [S. l.], v. 26, n. 4, p. 184–187, 2020. DOI: 10.36547/ams.26.4.707. Disponível em: https://journals.scicell.org/index.php/AMS/article/view/707. Acesso em: 28 mar. 2024.